University at Buffalo - Civil Structual and Environmental Engineering

Researchers in CSEE's Electronics Packaging Laboratory use laser Moire interferometry to measure submicron-scale deformation in solder joints that have been subjected to both elevated temperature and vibration. The lab is a world leader in creating damage mechanics models for electronics.

THE FACES OF CSEE

Christina Tsai
Asst. Professor

Environmental Engineering

ABOUT THE DEPARTMENT

ACADEMIC PROGRAMS

RESEARCH

NEWS & EVENTS

Earthquakes, the Great Lakes, submicron-scale damage mechanics: we are multifaceted in our teaching and research interests.

UNDERGRADUATE:

• B.S. in civil engineering

• B.S. in environmental engineering

• Combined degrees

GRADUATE:

• M.Eng.

• M.S.

• Ph.D.

Some of our facilities are unique in the world. Our location itself is a laboratory for some of our research. Our interdisciplinary collaborations are productive.

June 12, 08: Research to provide glimpse of how structures collapse

June 08: Ecosystem Restoration Workshop

May 8, 08: Steel bridge, concrete canoe teams take second place in regional contests

Apr 24, 08: Civil and Environmental students earn top national awards

A Greener Department

212 Ketter Hall • Buffalo, New York 14260 • Phone: 716-645-2114 ext. 2400 • Fax: 716-645-3733